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  • Contents
    2023 ,29(4):-[Abstract](164)[PDF](192)
  • ZHANG Kuozhong(张阔中)* **,HUANG Junying*,ZHANG Hui***,TANG Guangming*,ZHANG Zhimin*,YE Xiaochun*
    2023 ,(4):335-347[Abstract](103)[PDF](148)
  • YU Yong ( 余   泳)* **,CHEN Shudong* **,TONG Da* **,QI Donglin* **,PENG Fei* **,ZHAO Hua***
    2023 ,29(4):348-357[Abstract](219)[PDF](206)
  • HU Zhentao(胡振涛),SU Yujie,ZHANG Zihan
    2023 ,29(4):358-364[Abstract](172)[PDF](195)
  • LIU Andong(刘安东)*,ZHANG Baixin*,CUI Qi,ZHANG Dan*,NI Hongjie*
    2023 ,29(4):365-376[Abstract](174)[PDF](173)
  • JIANG Jiewei(蒋杰伟)*,ZHANG Yi*,XIE He**,GONG Jiamin*,ZHU Shaomin*,WU Shanjun** *,LI Zhongwen* **
    2023 ,29(4):377-387[Abstract](172)[PDF](180)
  • LIU Jiansheng(刘建胜)*,YUAN Bin*,YANG Zan*,ZHONG RAY Y**
    2023 ,29(4):388-396[Abstract](167)[PDF](258)
  • WU Jin(吴 进),WANG Lei,FENG Haoran,CHONG Gege
    2023 ,29(4):397-405[Abstract](148)[PDF](180)
  • CHEN Lei(陈 雷)*,SHI Jiaqi*,ZHANG Ting**
    2023 ,29(4):406-415[Abstract](182)[PDF](175)
  • WU Yuzhang(吴豫章)*,ZHI Tian**,SONG Xinkai**,LI Xi*
    2023 ,29(4):416-426[Abstract](167)[PDF](180)
  • XIE Xiaoyan(谢晓燕)*,HE Wanqi*,ZHU Yun**,YU Jinhao*
    2023 ,29(4):427-433[Abstract](163)[PDF](161)
  • REN Bin (任 彬)* **,ZHOU Qinyu*,LI Qibing*,LUO Wenfa***
    2023 ,29(4):434-444[Abstract](182)[PDF](201)

Past publicationmore>>

  • 2023
    (4)

  • 2023
    (3)

  • 2023
    (2)

  • 2023
    (1)

  • 2022
    28 (4)

  • 2022
    28 (3)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN:

    11-3683/N

  • ISSN:

    1006-6748

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