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  • Contents
    2023 ,29(1):-[Abstract](157)[PDF](1287)
  • PAN Kunbei（潘坤贝）* ** ***，ZHOU Bin* ***，ZHAO Yu* ***，BU Zhiyong* ***
    2023 ,29(1):1-11[Abstract](112)[PDF](87)
  • JIANG Zhinong (江志农)* **，CHEN Yuyang* **，ZHANG Jinjie* **，LI Zhaoyang* **，MAO Zhiwei* **，ZHI Haifeng***，LIU Fengchun***
    2023 ,29(1):12-21[Abstract](133)[PDF](83)
  • LI Chuanzheng(李传政)* **，XU Shuyan*，DONG Jihong*，LIU Bo*，ZHANG Yaoyu*，ZHENG Fusheng***
    2023 ,29(1):22-30[Abstract](106)[PDF](55)
  • SHAN Rui(山蕊)*，XIA Xinyuan*，YANG Kun**，CUI Xinyue*，LIAO Wang*，GAO Xu*
    2023 ,29(1):31-40[Abstract](105)[PDF](76)
  • ZHANG Xijun(张玺君)，HAO Jun，NIE Shengyuan，CUI Yong
    2023 ,29(1):41-49[Abstract](107)[PDF](79)
  • XIE Xiaoyan(谢晓燕)*，XU Hao*，ZHU Yun**，HE Wanqi*
    2023 ,29(1):50-59[Abstract](96)[PDF](60)
  • GENG Linkang(耿林康)*，RAO Jinjun* **，LEI Jingtao* **
    2023 ,29(1):60-67[Abstract](90)[PDF](63)
  • WU Jin(吴进)，GAO Yaqiong，YANG Ling，ZHAO Bo
    2023 ,29(1):68-77[Abstract](376)[PDF](124)
  • TANG Huapeng(唐华鹏)，QIN Danyang，YAN Mengying，YANG Jiaqiang，ZHANG Gengxin
    2023 ,29(1):78-86[Abstract](87)[PDF](59)
  • GAO Yunduan(高云端)*，WANG Zijia**，TIAN Ye*，HUANG Yan*，ZHANG Jinjie***
    2023 ,29(1):87-97[Abstract](141)[PDF](77)
  • SHU Zhan（舒展），DUAN Yong
    2023 ,29(1):98-104[Abstract](93)[PDF](132)
  • ZHANG Laixi(张来喜)，QIAN Feng，WU Mingliang
    2023 ,29(1):105-112[Abstract](96)[PDF](57)

Past publicationmore>>

  • 2023
    (1)

  • 2022
    28 (4)

  • 2022
    28 (3)

  • 2022
    28 (2)

  • 2022
    28 (1)

  • 2021
    27 (4)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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