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  • Contents
    2022 ,28(1):-[Abstract](659)[PDF](907)
  • YAN Zhenzhen (闫珍珍),LI Bo,YANG Mao,YAN Zhongjiang
    2022 ,28(1):1-9[Abstract](213)[PDF](266)
  • YANG Zhaoxin (杨兆鑫)*,YANG Ruizhe*,LI Meng*,YU Richard Fei* **,ZHANG Yanhua*
    2022 ,28(1):10-20[Abstract](239)[PDF](223)
  • REN Bin(任彬),PAN Yunjie
    2022 ,28(1):21-29[Abstract](202)[PDF](187)
  • ZHAO Jing(赵京)*,DUAN Yaxing*,ZHANG Ziqiang*,XIE Biyun**
    2022 ,28(1):30-39[Abstract](1059)[PDF](1273)
  • XIE Xiaoyan(谢晓燕)*,JI Shentao*,ZHU Yun**,YANG Kun**,XIA Xinyuan**,WANG Shuxin*
    2022 ,28(1):40-47[Abstract](188)[PDF](195)
  • ZHAO Wencang (赵文仓),WANG Chunxin,XU Changkai
    2022 ,28(1):48-55[Abstract](212)[PDF](191)
  • YANG Kun(杨堃),DUAN Yong
    2022 ,28(1):56-62[Abstract](205)[PDF](2327)
  • WU Jin(吴进),SHI Qianwen,XI Meng,WANG Lei,ZENG Huadie
    2022 ,28(1):63-71[Abstract](204)[PDF](178)
  • ZHAO Jianhua(赵建华)* ** ***,ZHAO Yabin**,ZHANG Xuze*,WANG Jin*,WANG Ziqi*,GAO Dianrong*,DU Guojun***
    2022 ,28(1):72-79[Abstract](194)[PDF](199)
  • ZHAO Chengze(赵铖泽)*,LI Meng* **,SUN Enchang*,HUO Ru*,LI Yu***,ZHANG Yanhua* **
    2022 ,28(1):80-90[Abstract](224)[PDF](213)
  • ZENG Wen(曾文),ZHENG Jia,WANG Dawei,XIONG Shuling,ZHANG Lei,WEI Xiaoqi
    2022 ,28(1):91-97[Abstract](171)[PDF](227)
  • MA Xiuhui (马秀慧) * **,WANG Rong***,CHEN Shudong* **,DU Rong* **,ZHU Danyang* **,ZHAO Hua***
    2022 ,28(1):98-106[Abstract](196)[PDF](181)
  • XU Lei (徐磊),LI Weifeng,YAO Yijing,CHANG Jing,FANG Hongyu,LI Xiaohui
    2022 ,28(1):107-114[Abstract](642)[PDF](191)

Past publicationmore>>

  • 2022
    (1)

  • 2021
    27 (4)

  • 2021
    27 (3)

  • 2021
    27 (2)

  • 2021
    27 (1)

  • 2020
    26 (4)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN:

    11-3683/N

  • ISSN:

    1006-6748

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