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  • Cover
    2026 ,32(2):-[Abstract](120)[PDF](135)
  • Contents
    2026 ,32(2):-[Abstract](114)[PDF](124)
  • Wen Juan (文 娟)* ** ***，Wu You* ***，Song Yang* ***，Pan Baisong* ***
    2026 ,32(2):109-120[Abstract](143)[PDF](139)
  • Lyu Cunchi (吕存驰)* **，Shi Xiao* ****，Lei Zhengyu* **，Li Qingwen* **，Zhao Xiaofang* ** *** *****
    2026 ,32(2):121-132[Abstract](125)[PDF](139)
  • Li Jin (李 进)*，Lin Zesheng**，Wang Qingguo*，Wang Siyuan**，Zhang Jinjie**
    2026 ,32(2):133-147[Abstract](123)[PDF](136)
  • Lei Zhengyu (雷正宇)*，Shi Xiao** ****，Lyu Cunchi* **，Li Qingwen* **，Zhao Xiaofang* ** *** *****
    2026 ,32(2):148-155[Abstract](110)[PDF](118)
  • Fu Shengqiang (付胜强)* **，Chen Shudong* **，Chen Xiaoxiao**，Yu Yong*，Du Jiale* **，Wang Ergang**
    2026 ,32(2):156-168[Abstract](116)[PDF](133)
  • Zhu Mengyang (朱孟阳)，Gong Zhiheng，Yuan Shaoke，Fei Yanqiong
    2026 ,32(2):169-176[Abstract](125)[PDF](144)
  • Shen Haobo (沈浩波)，Fang Yubin，Zhu Yuanke，Liang Chaojun
    2026 ,32(2):177-192[Abstract](112)[PDF](136)
  • Lin Yunhong (蔺云宏)* **，Wu Gaoyang****，Lin Yongmei****，Li Yunju*****，Chen Zhong***
    2026 ,32(2):193-201[Abstract](115)[PDF](138)
  • Zhang Rui (张 蕊)*，Wang Lijun* **，He Yanqing* **，Xu Hongjiao*，Lan Tian*，Xu Deshan*
    2026 ,32(2):202-216[Abstract](131)[PDF](134)
  • Mao Kebiao (毛克彪)* **，Xu Longhao**，Sayed M. Bateni*** ****，Yuan Zijin*
    2026 ,32(2):217-220[Abstract](110)[PDF](127)

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    (1)

  • 2025
    31 (4)

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    31 (3)

  • 2025
    31 (2)

  • 2025
    31 (1)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    No. 15, Fuxing Road, Beijing 100038, P.R.China

  • Tel:

    86-10-58882918,58882910

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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