| 姚春燕,杜宇振,王明环.静电喷雾线锯切割温度场和热应力场研究[J].高技术通讯(中文),2025,35(10):1145~1152 |
| 静电喷雾线锯切割温度场和热应力场研究 |
| Study on the temperature field and thermal stress field during wire sawing under the electrostatic spraying cooling method |
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| DOI：10. 3772 / j. issn. 1002-0470. 2025. 10. 011 |
| 中文关键词: 静电喷雾冷却； 线锯切割； 温度场； 热应力场 |
| 英文关键词: electrostatic spraying cooling, wire sawing, temperature field, thermalstress field |
| 基金项目: |
| 作者 | 单位 | | 姚春燕 | (浙江工业大学机械工程学院杭州 310023)
(特种装备制造与先进加工技术教育部/浙江省重点实验室杭州 310023) | | 杜宇振 | | | 王明环 | |
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| 摘要点击次数: 17 |
| 全文下载次数: 37 |
| 中文摘要: |
| 为了降低金刚石线锯切割过程中硅片的温度和热应力，将静电喷雾冷却方式应用于线锯切割。建立硅片温度场数学模型，模拟线锯切割过程中硅片的温度场分布，并通过线锯切割实验验证仿真结果，在此基础上将温度场结果作为边界条件进行热应力分析。仿真和实验结果表明，与浇注冷却和喷雾冷却方式相比，静电喷雾冷却方式下硅片最高温度分别降低了15.35%和5.99%，硅片最高热应力分别降低了33.30%和45.56%，静电喷雾冷却可以有效降低硅片温度，提高线锯切割过程中硅片温度分布均匀性，降低硅片热应力；在3种冷却方式下，硅片温度场和热应力场的分布规律相似，最高值都在切割区域的中部。 |
| 英文摘要: |
| To reduce the temperature and thermal stress of silicon wafers during diamond wire sawing, the electrostatic spraying cooling method is used in wire sawing.A mathematical model of heat generation during wire sawing process is established to simulate the distribution of temperature field of silicon wafers during this process. After verifying the result with sawing experiment, the temperature field is used as a boundary condition to carry out thermal stress analysis. The results show that compared with pouring and spraying, the maximum temperature of the wafer under electrostatic spraying cooling method is reduced by 15.35% and 5.99%, and the maximum thermal stress is reduced by 33.30% and 45.56%, respectively. The electrostatic spraying cooling method effectively lowers the temperature of silicon wafers, improve the uniformity of the temperature distribution in wire sawing, and reduce the thermal stress of silicon wafers. The distribution of temperature field and thermal stress field of the wafer under the three cooling methods are similar, and the maximum values are in the middle of the sawing area. |
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